Qulee RGM – Reactive Gas Monitor

Features

• Long term stable measurements results
• Closed Ion Source Utilizing a Magnetic Field
• Soft ionization provides less gas dissociation and higher sensitivity
• Decomposition and adsorption due to thermal reactions are minimized in the ionization chamber
• Short distance between the process chamber and ion source allows quick-response of analysis
• Wide pressure range from 10-6 to 13kPa is available. (Choice of orifices)
• No need for PC
• “One Click” function
• Max 120ºC High temperature bakeing.
• Electron bombard degas
• Protection and maintenance of ion source and secondary electron multiplier
• Traceability of analysis tube (patent pending)
• Various Leak Tests are Available (Helium leak test, air leak test, leak up)
• Capable of total pressure measurement (External ionization gauge GI-M2)
• This software is included and compatible with (Windows XP/7)

Applications

• For etching and CVD process
• Monitoring reactive gases during process
• End-point monitoring for etching and cleaning processes
• Residual gas analyzing
• Leak testing